Optical sensor module and method for manufacturing the same

ABSTRACT

An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component, a light sensing component, and a lid. The light emitting component is disposed within the first chamber and the light sensing component is disposed within the second chamber. The lid includes a first lens with a non-convex upper surface and a convex lower surface facing the light emitting component. The upper surface of the first lens may be substantially planar. The lid may further include a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed.

BACKGROUND

1. Technical Field

The present disclosure relates to an optical sensor module and a methodof manufacturing the same. The present disclosure also relates to aportable electronic device including the optical sensor module.

2. Description of the Related Art

An optical sensor module, such as a proximity sensor module, can be usedfor detecting the presence of an object near the optical sensor module.The optical sensor module includes a light source and an optical sensor.The optical sensor receives or senses light (generally infrared rays)emitted from the light source and reflected by an external object,thereby detecting the presence of the object.

A conventional optical sensor module can suffer from cross-talk.Cross-talk refers to light received by an optical sensor that was notemitted from the light source and reflected from an object to bedetected. Cross-talk is a type of interference or noise that can causereduced performance of an optical module.

SUMMARY

In accordance with an embodiment of the present disclosure, an opticalsensor module is provided. The optical sensor module includes a liddefining a first chamber and a second chamber isolated from the firstchamber, a light emitting component disposed within the first chamberand a light sensing component disposed within the second chamber. Thelid includes a first lens disposed at a top of the first chamber, thefirst lens including a non-convex upper surface and a convex lowersurface facing the light emitting component.

In accordance with another embodiment of the present disclosure, anoptical sensor module is provided. The optical sensor module includes abase substrate, a periphery barrier, a separation component and acapping substrate. The base substrate includes a surface with a lightemitting area and a light sensing area. The periphery barrier and theseparation component are disposed on the surface of the base substrate,wherein the periphery barrier and the separation component togetherdefine a first chamber surrounding the light emitting area and a secondchamber surrounding the light sensing area, and the first chamberprovides light from the light emitting area having a first wavelength.The capping substrate is disposed on the first chamber and the secondchamber, and an upper surface of the capping substrate is planar. Thecapping substrate includes a block portion for blocking light at thefirst wavelength.

In accordance with another embodiment, a method for manufacturing anoptical sensor module is provided. The method includes providing a basesubstrate, providing a lid, and disposing the lid on the base substrate.The base substrate includes a light emitting component and a lightsensing component disposed thereon. The lid defines a first chamber; asecond chamber isolated from the first chamber. The lid includes a firstlens disposed at a top of the first chamber, the first lens including aconvex lower surface and a non-convex upper surface; and a second lensor a light transmissive panel disposed at a top of the second chamber.The lid is disposed on the base substrate such that the lower surface ofthe first lens faces the light emitting component and a lower surface ofthe second lens faces the light sensing component.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate an example of cross-talk in an optical sensormodule;

FIGS. 2A and 2B illustrate an optical sensor module in accordance withan embodiment of the present disclosure;

FIG. 2C illustrates an optical sensor module in accordance with anembodiment of the present disclosure;

FIG. 2D illustrates an optical sensor module in accordance with anembodiment of the present disclosure;

FIGS. 3, 4 and 5 illustrate a capping substrate according to theembodiments of the present disclosure;

FIGS. 6A and 6B illustrate the optical sensor modules with differentarrangement of lenses according to the embodiments of the presentdisclosure;

FIGS. 7A, 7B and 7C illustrate an optical sensor module in accordancewith further embodiments of the present disclosure;

FIGS. 8A and 8B illustrate a method for manufacturing an optical sensormodule according to an embodiment of the present disclosure;

FIGS. 9A, 9B, 9C and 9D illustrate a step of providing the lid accordingto some embodiments of the present disclosure; and

FIGS. 10A, 10B, 10C, 10D and 10E illustrate a step of providing the lidaccording to another embodiment of the present disclosure.

Common reference numerals are used throughout the drawings and thedetailed description to indicate the same or similar components. Thepresent disclosure will be more apparent from the following detaileddescription taken in conjunction with the accompanying drawings.

DETAILED DESCRIPTION

FIGS. 1A and 1B illustrate an optical sensor module and an example ofcross-talk in the optical sensor module. As shown in FIG. 1A, a lightemitting component 11 and an optical sensor 12 are covered by atransparent molding material 13 for protecting the light emittingcomponent 11 and the optical sensor 12 from the environment; a lens 15is used to converge the light emitted from the light emitting component11. Light emitted from the light emitting component 11, illustrated byway of example in a range between C1 and C2, passes through a panel 130,arrives at an external object 140, and is then reflected by the object140. An example of light reflected by the object 140 is illustrated in arange between D1 and D2. The optical sensor module senses the presenceof the object 140 when the light reflected by the object 140 arrives ata light sensing region 123 of the optical sensor 12.

Although a lid 16 is used in the optical sensor module of FIG. 1A toprevent the emitted light from directly entering the light sensingregion 123 of the optical sensor 12, about 80% of the emitted light mayturn into cross-talk. For example, as shown in FIG. 1B, lightillustrated in the range between C3 and C4 emitted from the lightemitting component 11 is reflected by a second surface 132 of the panel130, as illustrated by the range of reflected light between D3 and D4,which enters the light sensing region 123. The light in the rangebetween D3 and D4 is not reflected by the object 140 but by the secondsurface 132 of the panel 130, and therefore is cross-talk and affectsthe accuracy of the optical module. Such kind of cross-talk may also becaused by light reflected by a first surface 131 of the panel 130.

Furthermore, the lid 16 can protect the lens 15 from being scratched ordamaged; however, the lid 16 may increase the size of the opticalmodule, the complexity of the manufacturing process, the manufacturingcost, and the product cost.

FIG. 2A and FIG. 2B illustrate schematic views of an optical sensormodule 200 in accordance with an embodiment of the present disclosure.FIG. 2B illustrates a schematic top view of the optical sensor module200. FIG. 2A illustrates a cross-sectional view taken along line I-I′ ofFIG. 2B.

Referring to FIG. 2A, the optical sensor module 200 includes a basesubstrate 201, a light emitting component 207 and a light sensingcomponent 209 on the base substrate 201, a first lens 204, and a secondlens 206. The light emitting component 207 is positioned in a lightemitting area (e.g., a receiving area of the base substrate 201 ontowhich the light emitting component 207 is disposed). The light sensingcomponent 209 is positioned in a light sensing area (e.g., a receivingarea of the base substrate 201 onto which the light sensing component209 is disposed).

The first lens 204 is disposed on the top of a first chamber 203 and hasan upper surface 204 a and a lower surface 204 b. The lower surface 204b of the first lens 204 is a convex surface and faces the light emittingcomponent 207. The upper surface 204 a of the first lens 204 is a planaror substantially planar surface, such that the optical sensor module 200can be attached to another substrate or printed circuit board by apick-and-place process. Thus, a vacuum nozzle used to pick and place theoptical sensor module can directly attach to the planer surface; thereis no need to add an additional lid to protect the first lens 204 andprovide a planar surface for the pick-and-place process. Therefore, thecost and the thickness of the optical sensor module 200 can be reduced.

The light emitting component 207 is disposed in the first chamber 203and may emit infrared rays or other wavelengths of light or radiation.In some embodiments, the light emitting component 207 is disposed on thebottom of the first chamber 203. In some embodiments, the position ofthe light emitting component 207 is adjustable to increase the emittedlight passing through the first lens 204. The light emitting component207 can be, but is not limited to, a light emitting diode or a verticalcavity surface emitting laser (VCSEL). In some embodiments, a VCSEL canreduce the light emission angle (for example, to be within about 20degrees) and minimize light scattering, thereby reducing cross-talk.

The second lens 206 is disposed on the top of a second chamber 205, andhas an upper surface 206 a and a lower surface 206 b. The second chamber205 is isolated from the first chamber 203, for example, by a separationcomponent 211 located therebetween. As shown in FIG. 2A, the lowersurface 206 b of the second lens 206 is a convex surface and faces thelight sensing component 209.

The light sensing component 209 is disposed in the second chamber 205 tosense or detect the light reflected by an external object. In someembodiments, the light sensing component 209 is disposed on the bottomof the second chamber 205. In some embodiments, the position of thelight sensing component 209 is adjustable to increase the receipt ofreflected light passing through the second lens 206. In someembodiments, a center of the light emitting component 207 is offset froman axis of the first lens 204. In some embodiments, a center of thelight sensing component 209 is offset from an axis of the second lens206. The location of the light emitting component 207 and the lightsensing component 209 can be adjusted to be close to the separationcomponent 211; the resulting optical sensor module 200 may have betterperformance than an optical sensor module in which a center of the lightemitting component 207 aligns with an axis of the first lens 204 and acenter of the light sensing component 209 aligns with an axis of thesecond lens 206.

Referring to FIG. 2A and FIG. 2B, a capping substrate 202 is formed atthe tops of the first and second chambers 203 and 205. The cappingsubstrate 202 includes a first penetrating hole 214 and a secondpenetrating hole 216. The first and second lenses 204 and 206 are formedin the first and second penetrating holes 214 and 216, respectively. Insome embodiments, one (or both) of the first and second lenses 204 and206 may further be an aspheric lens; in this embodiment, the size ofoptical sensor module 200 can be reduced.

The upper surface 206 a of the second lens 206 is a planar orsubstantially planar surface. In some embodiments, the upper surface 204a of the first lens 204 and the upper surface 206 a of the second lens206 are substantially coplanar with an upper surface of the cappingsubstrate 202; therefore, no lid is added to protect the lenses, ascompared to an embodiment in which a lid is added to protect a portionof one or both of the lenses 204, 206 that protrude beyond the cappingsubstrate 202. Thus, in this embodiment, the size of optical sensormodule 200 can be reduced.

In some embodiments, the capping substrate 202 is a metal substrate,such as copper or an alloy thereof. In some embodiments, the cappingsubstrate 202 is a plastic substrate, such as liquid crystal polymer orepoxy resin, or a composite substrate.

In some embodiments, a first light absorbing layer (not shown) isdisposed on a lower surface of the capping substrate 202. In someembodiments, the lower surface of the capping substrate 202 (i.e., thelower surface of the capping substrate 202 excluding the firstpenetrating hole 214 and the second penetrating hole 216) is covered bythe first light absorbing layer. In some embodiments, in addition to, oralternatively to, the first light absorbing layer on the lower surfaceof the capping substrate 202, a second light absorbing layer (not shown)is disposed on an upper surface of the capping substrate 202 (i.e., theupper surface of the capping substrate 202 excluding the firstpenetrating hole 214 and the second penetrating hole 216). The lightabsorbing layer or layers absorb at least some emissions (such asinfrared or other types of lights or radiations) from the light emittingcomponent 207. Thus, a portion of the capping substrate 202 (a blockportion) can block emissions which could result in cross-talk. The areaof the block portion is adjustable. The light absorbing layer(s) may beformed, for example, by use of a black oxide treatment, a carbon blackcoating, a stain, or other suitable light absorbing material.Additionally or alternatively, the capping substrate 202 may include alight absorbing material, such as carbon black or a light absorbingpigment. The use of a light absorbing layer or layers, and/or the use ofa light-absorbing material in the capping substrate 202, allows forabsorption of emissions from light emitting component 207 not passingthrough the first lens 204, and the absorption of reflections notpassing through the second lens 206; thereby cross-talk can be reduced.

The first chamber 203 and the second chamber 205 are surrounded by aperiphery barrier 210 and isolated from each other by the separationcomponent 211, such that the periphery barrier 210 and the separationcomponent 211 define the first chamber 203 and the second chamber 205.In some embodiments, one or more sidewalls of the periphery barrier 210and the separation component 211 have a light absorbing layer formedthereon, or may be formed of a light absorbing material. The peripherybarrier 210 and the separation component 211 connect to the lowersurface of the capping substrate 202. The base substrate 201 forms thebottom (in the orientation of FIG. 2A) of optical sensor module 200;thus the bottoms of the first chamber 203 and the second chamber 205 aredemarcated by the base substrate 201.

Table 1 illustrates the reduction of cross-talk achieved by an opticalsensor module according to this disclosure. Three optical sensor modulesA, B and C were tested, and the results are provided in Table 1. ModuleA was an optical sensor design in accordance with the illustration inFIGS. 2A and 2B. Module B was an optical sensor design such asillustrated in FIGS. 1A and 1B. Module C was a commercial optical sensormodule in which a biconvex lens was disposed on each of two chambers.The test performed on each of Modules A, B and C was the detection of anexternal object at a distance of 10 mm from the optical sensor module.

TABLE 1 Module A Module B Module C Cross-talk 0.40% 68.93% 0.47% Size of2.75 × 1.8 × 1.40 2.75 × 1.8 × 1.40 2.75 × 2.35 × 1.40 module (mm)

Comparing Module A and Module B, Module A achieves significantly bettercross-talk performance than Module B (i.e., 0.40% cross-talk for ModuleA versus 68.93% cross-talk for Module B) for about the same sizepackage. Comparing Module A and Module C, Module A is a smaller packagesize than Module C, and Module A further achieves better cross-talkperformance than Module C (i.e., 0.40% cross-talk in Module A versus0.47% cross-talk in Module C).

FIG. 2C illustrates a schematic view of an optical sensor module 300 inaccordance with an embodiment of the present disclosure. The opticalsensor module 300 shown in FIG. 2C is similar to the optical sensormodule 200 shown in FIG. 2A, except that the second lens 206 of FIG. 2Ais replaced by a transmissive panel 220 in FIG. 2C. The transmissivepanel 220 has an upper surface 220 a and a lower surface 220 b. Theupper surface 220 a and the lower surface 220 b of the transmissivepanel 220 are planar or substantially planar surfaces. In someembodiments, the upper surface 220 a is substantially coplanar to theupper surface of capping substrate 202. In some embodiments, the lowersurface 220 b is substantially coplanar to a lower surface of cappingsubstrate 202. The transmissive panel 220 may be made of a lighttransmissive material, such as, for example, glass, silicon, a lighttransmissive polymer (such as a polyimide), or a dry film (such aspolyimide film). The transmissive panel 220 may be selected to allowspecific wavelengths to pass.

In an alternative embodiment, the transmissive panel 220 can be attachedon the upper surface of the capping substrate 202. In this embodiment,the transmissive panel 220 may cover holes in the optical sensor module300 (e.g., the first and second penetrating holes 214 and 216 in theabsence of lens structures formed in the first and second penetratingholes 214 and 216).

FIG. 2D illustrates a schematic view of an optical sensor module 400 inaccordance with a further embodiment of the present disclosure. Theoptical sensor module 400 shown in FIG. 2D is similar to the opticalsensor module 300 shown in FIG. 2C, where the base substrate 201 in FIG.2D is implemented by a silicon wafer, and at least one light sensingcomponent 309 is formed in a light sensing area of the silicon wafer. Asillustrated in FIG. 2D, the light emitting component 207 may be disposedon and electrically connected to the light emitting area of the basesubstrate 201. In some embodiments, the light emitting component 207 andthe light sensing component 309 can be integrated within a same waferused to form the base substrate 201.

FIG. 3 illustrates a schematic view of the capping substrate 202 inaccordance with an embodiment of the present disclosure. As shown inFIG. 3, the capping substrate 202 defines a first penetrating hole 214and a second penetrating hole 216. The first lens 204 (not shown) ispositioned or formed in the first penetrating hole 214, and the secondlens 206 (not shown) or the transmissive panel 220 is positioned orformed in the second penetrating hole 216.

As shown in FIG. 3, the side wall of the first penetrating hole 214and/or the side wall of the second penetrating hole 216 defines one ormore grooves 223 extending to the upper surface (labeled as 202 a inFIG. 3) of the capping substrate 202 in accordance with someembodiments. In some embodiments, the side wall of the first penetratinghole 214 and/or the side wall of the second penetrating hole 216additionally or alternatively defines one or more grooves (not shown)extending to the lower surface (labeled as 202 b in FIG. 3) of thecapping substrate 202. The shape of the grooves is not particularlylimited. For example, a groove can be in the shape of a rectangle, atriangle or a cone. The groove(s) may be used to fasten a lens (e.g.,the first lens 204 or the second lens 206) to the capping substrate 202.

FIG. 4 illustrates a cross-sectional view of the capping substrate 202,with the first lens 204 and the second lens 206 placed or formed withinthe capping substrate 202. The view of FIG. 4 is taken along line I-I′of FIG. 2B in accordance with some embodiments. As shown in FIG. 4, eachof the side walls of the first and second penetrating holes 214 and 216include a protrusion 224 fitted to, or embedded into, the first lens andthe second lens 204 and 206, respectively, so as to more firmly fastenthe first lens 204 and the second lens 206 in the capping substrate 202.

FIG. 5 illustrates a schematic view of the capping substrate 202 inaccordance with an embodiment of the present disclosure. In thisembodiment, the capping substrate 202 defines one or more runners 233.As shown in FIG. 5, there are two runners 233, each connecting to one ofthe first penetrating hole 214 and the second penetrating hole 216. In aprocess for molding lenses, such as a transfer molding or a compressionmolding, a resin composition for making the lenses may be passed throughthe runner(s) 233 to fill the first penetrating hole 214 and the secondfirst penetrating hole 216; after being cured, the resin retained in therunners 233 can further fasten the first lens 204 and the second lens206 (or the transmissive panel 220) in the capping substrate. Therunner(s) 233 may be fully buried within the capping substrate 202, ormay be partially exposed from the upper surface of the capping substrate202 (as illustrated in FIG. 5).

FIG. 6A illustrates a schematic top view of an optical sensor module 500in accordance with an embodiment of the present disclosure. In FIG. 6A,a runner 233 connects the side wall of the first penetrating hole 214and a runner 233′ connects the side wall of the second penetrating hole216. The runner 233 is substantially parallel to runner 233′. Inaddition, a first line A′ parallel to a reference axis x and passingthrough the center of the first penetrating hole 214 is collinear with asecond line A″ parallel to the reference axis x and passing through thecenter of the second penetrating hole 216.

FIG. 6B illustrates a schematic top view of an optical sensor module 600in accordance with an embodiment of the present disclosure. As shown inFIG. 6B, a first line B′ parallel to a reference axis x and passingthrough the center of the first penetrating hole 214 is not collinearwith a second line B″ parallel to the reference axis x and passingthrough the center of the second penetrating hole 216. It has been foundthat as compared to the arrangement of FIG. 6A, the arrangement of FIG.6B may provide further cross-talk reduction (for example, from 0.15% to0.07%).

FIG. 7A illustrates a schematic view of an optical sensor module 700 inaccordance with further embodiments of the present disclosure. Theoptical sensor module 700 includes a base substrate 201 with a firstsurface 201 a, a periphery barrier 210, and a separation component 211disposed on the first surface 201 a of the base substrate 201. The firstsurface 201 a includes a light emitting component 207 and a lightsensing component 209. The periphery barrier 210 and the separationcomponent 211 define a first chamber 203 surrounding the light emittingcomponent 207 and a second chamber 205 surrounding the light sensingcomponent 209. The first chamber 203 and the second chamber 205 areisolated from each other by the separation component 211 disposedtherebetween. The light emitting component 207 in the first chamberemits light of about a first wavelength (e.g., within a range ofwavelengths including the first wavelength).

The optical sensor module 700 includes a capping substrate 202 disposedon the top of the first chamber 203 and the second chamber 205. Thecapping substrate 202 may be made of light transmissive material orlight blocking material. The upper surface 202 a of the cappingsubstrate 202 is planar. The capping substrate 202 in this embodimentincludes a block portion 230, which is capable of blocking or absorbinglight of about the first wavelength. The block portion 230 is located atthe top of the first chamber (e.g., on one or both of the lower surface202 b of the capping substrate 202 and the upper surface 202 a of thecapping substrate 202). In some embodiments, the block portion 230 maybe disposed adjacent to (e.g., directly adjacent to) the separationcomponent 211. With such an arrangement, emissions that could causecross-talk (e.g., light in the range between C3 and C4 in FIG. 1B) wouldbe blocked or absorbed by the block portion 230 so that the cross-talkcan be reduced. The block portion 230 may be made of a material thatblocks or absorbs light of about the first wavelength. In someembodiments, the block portion 230 may be additionally or alternativelydisposed on the upper surface of the capping substrate 202 over thesecond chamber 205, and may be adjacent to the separation component 211.In such an embodiment, the block portion 230 can block or absorbcross-talk or other unwanted light of about the first wavelength.Examples of emissions of the first wavelength include narrow-bandemissions with wavelengths in the range 850 nanometers (nm) to 950 nm.

FIG. 7B illustrates a schematic view of an optical sensor module 800 inaccordance with an embodiment of the present disclosure. The opticalsensor modules of FIGS. 7A and 7B have similar structure to each otherexcept that in FIG. 7A, the light sensing component 209 is positioned onthe base substrate 201, whereas in FIG. 7B, the light sensing component309 is buried or embedded in the base substrate 201. A furtherdifference between FIGS. 7A and 7B is the size and/or position of theblock portion 230.

FIG. 7C illustrate a schematic view of an optical sensor module 900 inaccordance with an embodiment of the present disclosure. The opticalsensor module 900 shown in FIG. 7C is similar to that shown in FIG. 7A,except with respect to the block portion 230.

In FIG. 7C, the block portion 230 is located on the top of the secondchamber 205 such that emissions of about the first wavelength from thefirst chamber 203 would not enter the second chamber 205. In someembodiments, as illustrated in FIG. 7C, the block portion 230 is asection of the capping substrate 202 including all, or a substantialportion, of the capping substrate 202 that lies over the second chamber205, and the block portion 230 occupies the full volume of the section.In other embodiments, the block portion 230 is on one or both of theupper surface 202 a and the lower surface 202 b of the capping substrate202, and covers at least the second chamber 205.

The block portion 230 may be made of a material that blocks emissionshaving about a first wavelength but allows emissions having about asecond wavelength to pass. Silicon is one example of such a material. Insome embodiments, the first wavelength is that of near-infrared orvisible light, and the second wavelength is that of mid-wavelengthinfrared or far infrared light. In other embodiments, the first and thesecond wavelengths may be close in value. In some embodiments, lighthaving wavelengths between 850 nm and 950 nm is emitted from the firstchamber 203, and the second chamber 205 is capped by a block portion 230that blocks light having wavelengths between 850 nm and 950 nm butallows light of other wavelengths (e.g., micrometer wavelengths) to passand be detected by the light sensing component 209 or 309 of the secondchamber 205.

In the embodiment shown in FIG. 7C, the second chamber 205 may be used,for example, to detect human physiological parameters, such as humantemperature. For such a use, the optical sensor module 900 may furtherinclude a third chamber (not shown), which is a light sensing chamberand forms a proximity sensor together with the first chamber. The first,second and third chambers of such a proximity sensor module can bedefined by a periphery barrier and two separation components disposed onthe base substrate and isolated from each other by the separationcomponents. In some embodiments of a proximity sensor module with threechambers, the second chamber 205 can be designed for detecting a pulseor oxygen saturation, such that the first chamber 203 emits green lightor red light.

The optical sensor module according to some embodiments of the presentdisclosure (such as illustrated and described for optical sensor modules200, 300, 400, 500, 600, 700, 800 and 900) is an air-type optical sensormodule, which is substantially airtight without applying a moldingcompound or other encapsulant to encapsulate the light emittingcomponent or the light sensing component. Chambers (e.g., 203, 205) areenclosed by a capping substrate (e.g., 202), a base substrate (e.g.,201), a periphery barrier (e.g., 210) and one or more separationcomponent(s) (e.g., 211) to form a closed space such that influencesfrom the external environment (e.g., humidity) can be reduced. Moreover,as compared to an optical sensor module as illustrated in FIG. 1A, theoptical sensor module of some embodiments of the present disclosureallows for two refractions of incident light (e.g., one when lightenters the lens from the air in the first chamber, and the other whenlight enters the ambient air from the lens), and thus, can moreefficiently condense the light; as a result, the package size can bereduced.

FIGS. 8A and 8B illustrate a method for manufacturing an optical sensormodule in accordance with an embodiment of the present disclosure.

FIG. 8A illustrates providing a base substrate 201. The base substrate201 includes a light emitting component 207 and a light sensingcomponent 209 disposed thereon.

FIG. 8B illustrates providing a lid and disposing the lid on the basesubstrate 201. The lid includes a capping substrate 202, a first chamber203; a second chamber 205 isolated from the first chamber 203; a firstlens 204 disposed at the top of the first chamber 203; and a second lens206 disposed at the top of the second chamber 205. A lower surface 204 bof the first lens 204 is a convex surface, and an upper surface 204 a ofthe first lens is a substantially planar surface. A lower surface 206 bof the second lens 206 is a convex surface, and an upper surface 206 aof the second lens is a substantially planar surface. In someembodiments, the second lens 206 can be replaced by a transmissive panel220 (e.g., as shown in FIG. 2C). The upper surface 204 a of the firstlens 204 and the upper surface 206 a of the second lens 206 (or theupper surface of the transmissive panel 220) are substantially coplanarwith each other and with a top surface of the capping substrate 202. Asillustrated in FIG. 8B, the lid is disposed on the base substrate 201such that the lower surface 204 b of the first lens 204 faces the lightemitting component 207, and the lower surface 206 b of the second lens206 (or the lower surface of the transmissive panel 220) faces the lightsensing component 209.

FIGS. 9A to 9D illustrate providing a lid according to an embodiment ofthe present disclosure.

In FIG. 9A, a capping substrate 202 with a first penetrating hole 214and a second penetrating hole 216 is provided. The capping substrate 202may be a metal substrate (e.g., made of copper, aluminum, or other metalor alloy) a wafer (e.g., a silicon wafer or a glass wafer) a plasticsubstrate made of a liquid crystal polymer, an epoxy resin, or acomposite substrate. The side walls of the first penetrating hole 214and the second penetrating hole 216 may define a groove or a protrusionas described with respect to FIGS. 3 and 4 (not shown in FIG. 9A). Thefirst penetrating hole 214 and the second penetrating hole 216 may beformed by etching or other hole-forming technique, such as laserdrilling. The groove and the protrusion can be formed together with theformation of the first penetrating hole 214 and the second penetratinghole 216. In some embodiments, the groove may be formed in a subsequentetching or laser drilling process.

In FIG. 9B, a light absorbing layer 901, such as a black oxide treatmentlayer, is formed on the capping substrate 202. For example, the lightabsorbing layer 901 may be formed on one or both of a top surface and abottom surface of the capping substrate 901. In some embodiments, thelight absorbing layer 901 may be formed within the capping substrate 202by adding carbon black or other pigment(s) in the capping substrate. Thelight absorbing layer 901 may be omitted in some embodiments.

In FIG. 9C, a polymer is injected into the first penetrating hole 214and the second penetrating hole 216 of the capping substrate 202; and,after curing, forms the first lens 204 and the second lens 206. When thefirst penetrating hole 214 and/or the second penetrating hole 216contain a groove as describe above (e.g., as in FIG. 3), the polymerfills the first penetrating hole 214, the second penetrating hole 216and the groove. Each of the first and second lenses 204, 206 has aconvex surface and a non-convex surface. The non-convex surfaces arepreferably substantially planar. In some embodiments, rather thanforming the second lens 206, the injected polymer is used to form atransmissive panel (e.g., 220). In some embodiments, in addition tofilling the first penetrating hole 214, the second penetrating hole 216and the groove, the polymer also covers portions of an upper surface ofthe capping substrate 202 to form a transmissive panel.

In some embodiments, the capping substrate includes a runner (e.g., asdescribed with respect to FIGS. 5, 6A and 6B), and the polymer isinjected into the first penetrating hole 214 and the second penetratinghole 216 by passing through the runner.

In FIG. 9D, a periphery barrier 210 and a separation component 211 areprovided and attached to the capping substrate 202. In some embodiments,the periphery barrier 210 and the separation component 211 can be madefrom a wafer, such as by forming the cavities of the first chamber 203and the second chamber 205 in the wafer. The capping substrate 202 formsthe top of the lid while the periphery barrier 210 forms the side wallsof the lid. The first chamber and the second chamber of the lid aredefined by the periphery barrier 210 and the separation component 211,and the tops of the first and second chambers are demarcated by thecapping substrate 202. The capping substrate 202 is attached to theperiphery barrier 210 and the separation component 211 in a manner suchthat the convex surfaces of the first lens 204 and the second lens 206face inward towards the first chamber 203 and the second chamber 205,respectively. The non-convex surfaces of the first lens 204 and thesecond lens 206 and the upper surface of the capping substrate 202 aresubstantially coplanar; therefore, the capping substrate 202 with thefirst lens 204 and the second lens 206 can be easily moved and attachedto the periphery barrier 210 and the separation component 211 forexample, by a vacuum nozzle. By way of comparison, if the first lens 204or the second lens 206 were to protrude from the upper surface of thecapping substrate 202, an additional cover may be needed to protect thelens and to facilitate the attaching process, which would increase thesize of the optical sensor module and the complexity of themanufacturing of the optical sensor module. In the embodiment of FIG.9D, the periphery barrier 210 and the separation component 211 arepositioned such that a light absorbing layer 901 is on the side of thecapping substrate 202 facing towards the first chamber 203 and thesecond chamber 205. In other embodiments, the periphery barrier 210 andthe separation component 211 are positioned such that a light absorbinglayer 901 formed on the opposite side of the capping substrate 202 facesaway from the first chamber 203 and the second chamber 205. In yet otherembodiments, the light absorbing layer 901 is omitted, or there is alight absorbing layer 901 on both sides of the capping substrate 202.

FIGS. 10A through 10D illustrate providing the lid according to anembodiment of the present disclosure. FIG. 10A illustrates a schematictop view of a molding lens 1000 including a frame 910, a first lens 204connected to the frame 910 by a first runner 911 and a second lens 206(or a transmissive panel) connected to the frame 910 by a second runner912. The molding lens 1000 may be formed, for example, by transfermolding or compression molding. In some embodiments, a polymer isinjected into a die with a pre-determined pattern of lenses (andoptionally transmissive panels). FIG. 10B illustrates a cross-sectionalview of the molding lens 1000 taken along line II-II′ of FIG. 10A.

FIG. 10C illustrates a molding compound layer 920 applied (as shown inFIG. 10D) so as to cover the frame 910, the first runner 911 and thesecond runner 912, and to expose the first lens 204 and the second lens206 (or transmissive panel).

In FIG. 10E, a periphery barrier 210 and a separation component 211 areattached to the molding compound layer 920. The molding compound layer920 and the molding lens 1000 together form the top of the lid, whilethe periphery barrier 210 forms the side walls of the lid. A firstchamber 203 is defined by the periphery barrier 210 and the separationcomponent 211, and demarcated by the downward-facing surface of themolding compound layer 920. A second chamber 205 is defined by theperiphery barrier 210 and the separation component 211, and demarcatedby the downward-facing surface of the molding compound layer 920. Thefirst lens 204 and the second lens 206 each have a convex surface and anon-convex surface, where the non-convex surfaces are the downwardfacing surfaces of the corresponding lenses. The non-convex surface ofthe first lens 204 is a substantially planar surface; therefore, themolding lens 1000 with the molding compound layer 920 applied thereon(e.g., as in FIG. 10D) can be easily moved and attached to the peripherybarrier 210 and the separation component 211; for example, by a vacuumnozzle. Preferably, both of the non-convex surfaces of the first lens204 and the second lens 206 are substantially planar surfaces, andsubstantially coplanar with a top surface of the lid as formed (e.g.,the upper surfaces of the first runner 911, the second runner 912, thefirst lens 204, the second lens 206, and the molding compound layer 920are substantially coplanar as illustrated in FIG. 10D). However, if oneor both of the first lens 204 and the second lens 206 protrude from thetop surface of the lid, an additional cover may be applied to protectthe lens and to facilitate the attaching process.

After providing the lid in accordance with FIGS. 9A to 9D or FIGS. 10Ato 10E, the lid is disposed on the base substrate (e.g., 201) such thatthe downward-facing surface of the first lens (e.g., 204) faces thelight emitting component (e.g., 207), and the downward-facing surface ofsecond lens (e.g., 206, or a transmissive panel) faces the light sensingcomponent (e.g., 209, 309).

In some embodiments, the optical sensor module according to the presentdisclosure can be integrated into a portable electronic device with ascreen.

As used herein, the terms “substantially,” “substantial,”“approximately,” and “about” are used to describe and account for smallvariations. When used in conjunction with an event or circumstance, theterms can refer to instances in which the event or circumstance occursprecisely as well as instances in which the event or circumstance occursto a close approximation. For example, the terms can refer to less thanor equal to ±10%, such as less than or equal to ±5%, less than or equalto ±4%, less than or equal to ±3%, less than or equal to ±2%, less thanor equal to ±1%, less than or equal to ±0.5%, less than or equal to±0.1%, or less than or equal to ±0.05%.

A surface can be deemed to be planar or substantially planar if adifference between a highest point and a lowest point on the surface issmall, such as no greater than 1 μm, no greater than 5 μm, no greaterthan 10 μm, or no greater than 50 μm. Two surfaces can be deemed to becoplanar or substantially coplanar if a displacement between the twosurfaces is small, such as no greater than 1 μm, no greater than 5 μm,no greater than 10 μm, or no greater than 50 μm.

Amounts, ratios, and other numerical values are sometimes presentedherein in a range format. It is to be understood that such range formatis used for convenience and brevity and should be understood flexibly toinclude numerical values explicitly specified as limits of a range, butalso to include all individual numerical values or sub-rangesencompassed within that range as if each numerical value and sub-rangeis explicitly specified.

While the present disclosure has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations do not limit the present disclosure. It should beunderstood by those skilled in the art that various changes may be madeand equivalents may be substituted without departing from the truespirit and scope of the present disclosure as defined by the appendedclaims. The illustrations may not be necessarily drawn to scale. Theremay be distinctions between the artistic renditions in the presentdisclosure and the actual apparatus due to manufacturing processes andtolerances. There may be other embodiments of the present disclosurewhich are not specifically illustrated. The specification and drawingsare to be regarded as illustrative rather than restrictive.Modifications may be made to adapt a particular situation, material,composition of matter, method, or process to the objective, spirit andscope of the present disclosure. All such modifications are intended tobe within the scope of the claims appended hereto. While the methodsdisclosed herein have been described with reference to particularoperations performed in a particular order, it will be understood thatthese operations may be combined, sub-divided, or re-ordered to form anequivalent method without departing from the teachings of the presentdisclosure. Accordingly, unless specifically indicated herein, the orderand grouping of the operations are not limitations of the presentdisclosure.

What is claimed is:
 1. An optical sensor module, comprising: a liddefining a first chamber and a second chamber isolated from the firstchamber; a light emitting component disposed within the first chamber;and a light sensing component disposed within the second chamber, thelid comprising a first lens disposed at a top of the first chamber, thefirst lens including a non-convex upper surface and a convex lowersurface facing the light emitting component.
 2. The optical sensormodule of claim 1, wherein the upper surface of the first lens isplanar, the lid further comprising a capping substrate and one of asecond lens or a transmissive panel disposed at a top of the secondchamber.
 3. The optical sensor module of claim 2, wherein the cappingsubstrate surrounds the first lens and the second lens or thetransmissive panel, and wherein the second lens or the transmissivepanel includes a planar upper surface substantially coplanar with theupper surface of the first lens and an upper surface of the cappingsubstrate.
 4. The optical sensor module of claim 2, wherein a first lineparallel to a reference axis and passing through a center of the firstlens is collinear with a second line parallel to the reference axis andpassing through a center of the second lens or the transmissive panel.5. The optical sensor module of claim 2, wherein a first line parallelto a reference axis and passing through a center of the first lens isnot collinear with a second line parallel to the reference axis andpassing through a center of the second lens or transmissive panel. 6.The optical sensor module of claim 1, the lid further comprising asecond lens and a capping substrate, wherein the top of the firstchamber and a top of the second chamber are demarcated by the cappingsubstrate, and wherein the capping substrate defines a first penetratinghole in which the first lens is formed or disposed and a secondpenetrating hole in which the second lens is formed or disposed.
 7. Theoptical sensor module of claim 6, wherein side walls of the first andsecond penetrating holes define grooves extending to an upper surface ofthe capping substrate.
 8. The optical sensor module of claim 6, whereinside walls of the first and second penetrating holes define protrusionsembedded into the first lens and the second lens, respectively.
 9. Theoptical sensor module of claim 6, the capping substrate further defininga runner connecting the side wall of the first penetrating hole or theside wall of the second penetrating hole.
 10. The optical sensor moduleof claim 6, the lid further comprising a light absorbing layer on alower surface of the capping substrate.
 11. The optical sensor module ofclaim 6, the lid further comprising a light absorbing layer on an uppersurface of the capping substrate.
 12. The optical sensor module of claim6, the lid further comprising a periphery barrier and a separationcomponent connected to a lower surface of the capping substrate anddefining the first chamber and the second chamber.
 13. A method formanufacturing an optical sensor module, comprising: providing a basesubstrate with a light emitting component and a light sensing componentdisposed thereon; providing a lid defining a first chamber and a secondchamber isolated from the first chamber, the lid comprising: a firstlens disposed at a top of the first chamber, the first lens including aconvex lower surface and a non-convex upper surface; and a second lensor a light transmissive panel disposed at a top of the second chamber;and disposing the lid on the base substrate such that the lower surfaceof the first lens faces the light emitting component and a lower surfaceof the second lens faces the light sensing component.
 14. The method ofclaim 13, wherein the lid further comprises a capping substrate.
 15. Themethod of claim 14, wherein the capping substrate defines a firstpenetrating hole and a second penetrating hole, wherein side walls ofthe first and second penetrating holes define respective groovesextending to an upper surface of the capping substrate, and the firstand second penetrating holes and the grooves are filled with a resincomposition.
 16. The method of claim 13, further comprising, prior toproviding the lid, forming the lid by: providing a molding lens, whereinthe molding lens comprises a frame, a first lens connected to the frameby a first runner, and a second lens connected to the frame by a secondrunner; forming a molding compound layer covering the frame and thefirst and second runners and exposing the first and second lenses; andforming a periphery barrier and a separation component on the moldingcompound layer, wherein the periphery barrier is formed at the peripheryof the molding compound layer and, together with the separationcomponent, defines the first chamber and the second chamber.
 17. Anoptical sensor module, comprising: a base substrate with a surfaceincluding a light emitting area and a light sensing area; a peripherybarrier and a separation component disposed on the surface of the basesubstrate, wherein the periphery barrier and the separation componenttogether define a first chamber surrounding the light emitting area anda second chamber surrounding the light sensing area, and the firstchamber provides light from the light emitting area having a firstwavelength; and a capping substrate disposed on the first chamber andthe second chamber, wherein an upper surface of the capping substrate isplanar, and the capping substrate includes a block portion for blockinglight at the first wavelength.
 18. The optical sensor module of claim17, wherein the separation component separates the first and secondchambers, and the block portion is located at a top of the firstchamber.
 19. The optical sensor module of claim 17, wherein theseparation component separates the first and second chambers, and theblock portion is located at a top of the second chamber.
 20. The opticalsensor module of claim 17, wherein the block portion allows light at asecond wavelength to pass.